In a remarkable advancement within the world of semiconductor packaging, Indium Corporation is taking a significant leap forward. At the International Conference on Electronics Packaging (ICEP) 2024, held from April 17-20 in Toyama, Japan, the company’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is set to present an intriguing research paper. This paper, titled “Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging,” addresses critical aspects of modern semiconductor assembly processes.
The increasing complexity and miniaturization of electronic devices are pushing the boundaries of current technology, especially in semiconductor packaging. As devices become thinner and more powerful, they also become more susceptible to issues like warpage during the assembly process. Traditional materials and methods are gradually becoming inadequate to handle these emerging challenges. This is where Indium Corporation’s research steps in, offering potential breakthrough solutions.
Lim’s presentation is anticipated to shed light on the use of low-temperature materials in semiconductor packaging. The use of these materials could be a game-changer, particularly in addressing the warpage caused by high-temperature processes. Additionally, such materials are vital for temperature-sensitive components like substrates, die, and sensors.
The significance of this research lies not only in improving the manufacturing process but also in its environmental impact. Lower processing temperatures imply reduced energy consumption and a smaller carbon footprint. This aligns with the growing demand for more sustainable manufacturing practices in the electronics industry.
Delving deeper into the potential of low-temperature materials, Lim explains, “If Sn-Bi-based solder alloys are carefully designed, with optimized production processes, SAC and low-temperature solder hybrid joint systems can revolutionize thermomechanical and fatigue performance.” The benefits outlined include lower-temperature reflow capabilities and enhanced resistance to thermal shocks, crucial for high-temperature applications.
Beyond her presentation, Lim’s role at Indium Corporation encompasses close collaboration with R&D, manufacturing teams, and leading semiconductor companies worldwide. Her expertise is recognized through her involvement with the International Electronics Manufacturing Initiative’s (iNEMI) Packaging Technology Integration Group and the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society Malaysia Chapter.
Indium Corporation’s commitment to innovation in materials science extends well beyond the realm of semiconductor packaging. As an essential business, the company has played a crucial role during the Coronavirus crisis by supporting a range of critical markets. From medical devices like ventilators and pacemakers to emergency responder equipment, the company’s materials solutions have been integral in various sectors.
In the automotive industry, the rise of electric vehicles and increased electronic integration poses new challenges. Indium Corporation responds with materials designed to withstand higher voltages and temperatures, vital for automotive-grade reliability standards. Similarly, in the defense sector, the need for high-reliability, high-performance materials is paramount, and Indium Corporation’s precision products are tailored for such demanding environments.
The company’s impact is also seen in the rapidly expanding 5G market. The increased power demands of 5G devices necessitate the development of new materials capable of efficient heat dissipation. Indium Corporation’s line of thermal interface materials and soldering solutions are at the forefront of meeting these new challenges.
As a leader in thermal management, Indium Corporation’s innovations enable electronic devices to operate at cooler temperatures, increasing efficiencies and longevity. Their products, such as Heat-Springs® and m2TIM™, represent the cutting edge of metal-based thermal interface materials.
Indium Corporation, founded in 1934, has established itself as a premier materials refiner, smelter, manufacturer, and supplier in the electronics, semiconductor, and thermal management markets. Their ongoing commitment to innovation is evident in their global presence and their diverse range of products, encompassing solders, fluxes, thermal interface materials, and various metals and compounds.
For more information about Indium Corporation and their advancements in semiconductor packaging and materials science, visit their website or follow their LinkedIn page, From One Engineer To Another®.
