Saki Corporation Unveils Groundbreaking Inspection Innovation at IPC APEX Expo 2024
Anaheim, California – In an impressive display of technological prowess, Saki Corporation is set to unveil its latest inspection innovation at the IPC APEX Expo 2024, marking a significant leap forward in the electronic component inspection industry. Saki Corporation, a leading name in electronic module automatic inspection equipment, has consistently pushed the boundaries of what’s […]
Indium Corporation Spearheads Innovations in Semiconductor Packaging at ICEP 2024
In a remarkable advancement within the world of semiconductor packaging, Indium Corporation is taking a significant leap forward. At the International Conference on Electronics Packaging (ICEP) 2024, held from April 17-20 in Toyama, Japan, the company’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is set to present an intriguing research […]
